Logic Application
The logic applications include a very wide variety of devices, that's why
our engineers will study each case to find out the most suitable
solution, to reach the best performance possible.
Our proposals include the possibility to use advanced vertical technologies
down to 60µm pitch, in high parallel configuration not interleaved; or
alternatively for pitch down to 30µm epoxy cantilever H9 and Helium technologies
to test Cu under pad and POP structure, low-k, minimizing the structure damage under the
pads, up to 8 parallel devices under test.
Our engineering team will be available to fully support you in the design of the
probe card, customizing the PCB according to your specifications.
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