Probe Information File
DATE:
(dd/mm/yyyy)
*
DEVICE NAME:
*
DESIGNER:
*
e_mail:
*
microns
mils
DIE SIZE:
Single Site
PCB:
Step Size
PCB IMPEDANCE:
Multiple Site
TOTAL PROBES:
Single Site
TESTER PLATFORM:
Multiple Site
PROBER PLATFORM:
PROBE TIP SIZE:
1.0 Mil
1.5 Mil
2.0 Mil
Other:
WIRE SIZE:
8 Mil
10 Mil
12 Mil
Best Fit
Other:
PROBE TIP DEPTH:
100 Mils.
150 Mils.
340 Mils.
Other:
PROBING TEMPERATURE:
Ambient
Other
Other:
CARD LAYOUT FROM:
Coordinates
Wafer
Glass Mask
file :
CARD ORIENTATION:
Optional
Specified
TRACES SPECIFIED:
Yes
No
STIFFENER REQUIRED:
Yes
No
DELIVERY SCHEDULE:
(dd/mm/yyyy)
Company Name:
*
Revision Date:
Total # of Pads:
Pad Size:
Units:
(*) mandatory
