Who we are
Technoprobe is a microelectronic industry leader in the design, development, manufacture, sale and support of
advanced semiconductor wafer probe cards;
Technoprobe was founded in 1993. In 1995 the company established its headquarters in Cernusco Lombardone, Italy.
During 2000 Technoprobe opened a manufacturing facility in France; during 2004 a manufacturing facility in Singapore;
during 2006 a repair facility in Taiwan;
Market focus.
Technoprobe mission is to get full customer satisfaction by supplying competitive products in Quality, Technological innovation, Service and Price.
Our guideline is the continuous improvement of processes, products, people, instruments and management system.
Technoprobe can offer epoxy technology or vertical technology probe cards.
Through our vast engineering experience the two technologies have been optimized reaching levels of excellence in vertical and epoxy technology.
The epoxy technology offers not only the advantage of short delivery times and reduced costs, but also advanced technological content due to many years of development.
Our epoxy technology can reach very small linear pitch down to 30 µm, very precise controlled force and scub marks to reduce the risk of low-K dielectrical damage on contact pads.
The vertical technology satisfies the need for greater parallelism, higher pin count, higher device density and larger array size up to 1 TD for 200 mm wafer.
The new vertical proprietary technology ROUTE60™ can easily reach 60 um pitch.
This new generation of vertical probe cards has low probe force to reduce risk of low-K dielectric damage and controlled scrub for a lower contact resistance.
OVERVIEW
QUALITY AND ENVIRONMENTAL POLICY
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