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¤ June/2007, Singapore |
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Technoprobe received STMicroelectonics “Partners in Ramp
Programme” award in recognition of outstanding performance,
overall support and commitment rendered during the production ramp up
from years 2005 to 2006. The award, related to the Asia Pacific region
, was presented to only Technoprobe among STMicroelectronics probe card
suppliers.
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¤ June/2007, San Diego (CA) |
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Technoprobe and STMicroelectronics awarded as “best presentation
overall” at the SWTW 2007. During the SWTW conference
STMicroelectronics presented the advantages of Technoprobe proprietary
ROUTE60™ technology compared to the other traditional
technologies available on the market. The presentation shows the
advantages of the vertical ROUTE60™ technology for fine pitch
application and low pad damage requirements.
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¤ April/2006 |
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Delivered the first
ROUTE60™ probe card, a new proprietary vertical technology
for fine pitch application and low pad damage requirements.
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¤ March/2005 |
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Technoprobe introduced a new
cantilever technology, called "Helium" to test low-k pad on the wafer.
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¤ February/2005 |
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Vertical hard ceramic
technology released with long guide concept for better alignment and
longer life, min 95µm pitch.
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¤ June/2004 |
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2.5µm cobra card
released, 98µm pitch large array testing "4x4".
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¤ May/2004 |
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H9 Technology released for Cu
under pads.
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¤ May/2003 |
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Interposer technology
released, wireless solution for best performance.
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¤ April/2002 |
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//32 testing complex shelf
probecard.
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¤ March/2002 |
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Start up cobra card
production min 110µm pitch.
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¤ September/2001 |
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Wave technology for ultra low
fine pitch, down 30µm linear pitch.
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¤ June/2000 |
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//16 testing by 2x8 shelf
probe card. |
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¤ August/1998 |
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//8 testing by cantilever
probe card. |
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¤ November/1997 |
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//4 testing by cantilever
probe card |
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¤ 1995 |
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ACTIVITY STARTUP
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¤ |
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Top |
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NEWS
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